「boding」被用作「bode」的现在进行时态而使用。其用法如下。
- I am boding
- 我没事
- you are boding
- 你很好
- he/she/it is boding
- 他/她/很好
- we are boding
- 我们正在建立联系
- you are boding
- 你很好
- they are boding
- 他们很好
「boding」被用作「bode」的过去进行时态。其用法如下。
- I was boding
- 我答应过
- you were boding
- 你很好
- he/she/it was boding
- 他/她/很好
- we were boding
- 我们被束缚了
- you were boding
- 你很好
- they were boding
- 他们很好
「boding」被用作「bode」的未来进行时态而使用。其用法如下。
- I will be boding
- 我加入
- you will be boding
- 你会被束缚的
- he/she/it will be boding
- 他/她/会没事的
- we will be boding
- 我们加入
- you will be boding
- 你会被束缚的
- they will be boding
- 他们将团结起来
「boding」被用作「bode」的现在完成进行时态。其用法如下。
- I have been boding
- 我已经联系过
- you have been boding
- 你被激怒了
- he/she/it has been boding
- 他/她/很好
- we have been boding
- 我们加深了我们的联系
- you have been boding
- 你被激怒了
- they have been boding
- 他们被激怒了
「boding」被用作「bode」的过去完成进行时态而使用。其用法如下。
- I had been boding
- 我在争论
- you had been boding
- 你们在争论
- he/she/it had been boding
- 他/她/这是一个预兆
- we had been boding
- 我们志趣相投
- you had been boding
- 你们在争论
- they had been boding
- 他们很兴奋
「boding」は「bode」的将来完成进行时态而使用。其用法如下。
- I will have been boding
- 我本来就很好
- you will have been boding
- 你会小心的
- he/she/it will have been boding
- 他/她/这将是一个预兆
- we will have been boding
- 我们很好
- you will have been boding
- 你会小心的
- they will have been boding
- 他们会没事的
“boding”的同义词列表。 让我们按顺序来记住吧!。
boding是一个英语单词,有几个不同的含义。 让我们用例句来解释每个的含义和用法!
Similarly, a bonding surface (3a) of a lower plate member (3) and a
boding
surface (23) of the frame member (2) are diffusion-bonded at a high pressure.
类似地,下板构件3的接合表面3a和框架构件2的
接合
表面23也在高压下扩散接合。
The components are bonded by diffusion
boding
, friction bonding, wax bonding, etc., after abutting the bonding surfaces with each other.
上述各部件通过扩散
接合
、摩擦接合、钎焊等使接合面彼此接触而接合。
Nobody liked Borchgrevink very much at that time, but he had a dynamic quality and a set purpose to get out again to the unknown South that struck some of us as
boding
well for exploration .
当时没有人很喜欢博奇格雷文克,但他有一种充满活力的品质,给自己设定了再次出发进入未知南极洲的目标,他是我们探索的先驱。他们报道说,
他们
身上有一些令人心酸的东西。 。
In the above described
boding
of the flange fixation member (15), the flange fixation member (15) of a thermoplastic film is facilitate separation of the bonded flange fixation member (15) from the flange section (12), the fixation member (15) is adapted such that the direction of the separation agrees with the direction of the flange (12), the separation progresses in the minimum width of the flange fixation member (15) perpendicular to the direction of the separation, and the separation requires minimum force.
[解决方案] 覆盖
物品
的储存部11、具有沿围绕储存部11的开口边缘向外突出的凸缘部12的盖构件13、以及用凸缘部12固定盖构件13的安装部14。容器的凸缘部12的一侧与安装件14的表面接触,凸缘部12的另一表面及其周围的安装件14的表面沿凸缘方向涂有凸缘固定材料。 12. 15将盖构件13安装到安装部14上,并且为了将凸缘固定材料15粘附到凸缘部12的另一表面和安装部14周围的表面,使用由以下材料制成的凸缘固定材料:为了将粘附的凸缘固定材料15从凸缘部12剥离,凸缘固定材料15的剥离方向必须与凸缘部12的方向一致,并且以最小宽度进行剥离凸缘固定材料15垂直于该方向,且剥离所需的力最小化,其设置在固定件15上。
The method for manufacturing a honeycomb structure is characterized by comprising a molding step of molding a raw material composition to prepare columnar honeycomb molded products comprising a number of cells partitioned with cell walls and provided parallel to each other in the longitudinal direction, a burning step of burning the honeycomb molded product to prepare a honeycomb burned product, a water retaining adhesive material paste preparation step of preparing a water retaining agent-containing water retaining adhesive material paste, and a bonding step of
boding
a plurality of the above honeycomb burned products to each other with the aid of the water retaining adhesive material paste to prepare a honeycomb assembly.
本发明提供一种蜂窝结构体的制造方法,其能够防止填充粘接剂糊剂时粘接剂糊剂的流动性变低,并且能够以高作业效率形成粘接剂糊剂层。是对原料组合物进行成型
,
制造隔着孔格壁在长度方向上并列配置有多个孔格的柱状蜂窝成形体的工序。本发明的特征在于,包括:将蜂窝成型体烧成的烧成体;准备含有保水剂的保水粘接剂糊剂的保水粘接剂糊剂准备工序;以及多个蜂窝烧成工序。使用保水粘合剂浆料将蜂窝体粘合以产生蜂窝骨料。
Disclosed is a semiconductor device provided with a semiconductor element having an electrode pad, a substrate which is mounted with the semiconductor element and is formed with an electrically bonding member, and a bonding wire which electrically connects the electrode pad and the electrically bonding member, wherein: the main component metal of the semiconductor element and the electrode pad is either the same metal as the main component metal for the bonding wire or is different from the main component metal for the
boding
wire; and when the main component metal of the electrode pad is different from the main component metal of the bonding wire, the speed at which the main component metal of the bonding wire and the main component metal of the electrode pad mutually diffuse at the bonding section of the bonding wire and the electrode pad at the post cure temperature of a sealing resin is slower than the speed at which gold (Au) and aluminum (Al) mutually diffuse at the bonding section of aluminum (Al) and gold (Au) at the post cure temperature.
本发明的半导体器件包括:半导体元件,其具有电极焊盘;基材,其上安装有半导体元件;以及电接合部件,其形成在基材上;以及接合线,其将电极焊盘与电接合部件电连接。 ,半导体元件和接合线电极焊盘的主要成分金属与接合线的主要成分金属相同,或者与接合线的主要成分金属不同,并且与接合线的主要成分金属不同。当
成分
金属不同时,在一定条件下,键合线的主要成分金属和电极焊盘的主要成分金属在键合线和电极焊盘之间的接合处相互扩散的速率。密封树脂的后固化温度的特征在于,在一定温度下,其速度低于金(Au)和铝(Al)在铝(Al)和金(Au)之间的接合处相互扩散的速度。后固化温度。
The rebuilt roads I traveled in northern Afghanistan were in excellent shape, and traffic on them was brisk,
boding
well for commerce.
)阿富汗北部重建的道路状况良好,交通畅通,对商业来说
是个好兆头
。
Highlight Masaan won a special jury prize for a film debut in Cannes’ Certain Regard as well as a Fipresci mention,
boding
well for the directorial debut for director Neeraj Ghaywan.
另一方面,导演尼拉吉·盖万(Neeraj Ghaiwan)凭借首部故事片《生、死和中间的事》让世界惊叹不已,在戛纳电影节首映后,他获得了一种关注单元的未来前途特别奖和国际影评人奖。获得联邦奖。
A die
boding
pad (65) is arranged on an upper surface of a printed wiring-board-like substrate (52), and the lower surface of the semiconductor element (53) is bonded to the die bonding pad (65) with a die bonding resin (74).
在印刷配线板等基板52的上表面设置有芯片接合垫65,半导体元件53的下表面通过芯片接合树脂74接合在芯片接合垫65上。
With respect to the gold alloy bonding wire, in the crystal grain structure of longitudinal section of
boding
wire, the ratio of area of crystal grains exhibiting orientation to area of crystal grains exhibiting orientation among the crystal orientations in the longitudinal direction of wire is 1.2 or greater.
本发明综合提高了楔形接头的高强度高弹性、环路形状稳定性、焊丝流动控制性、
可倾斜性
、可焊性或疲劳特性,以实现窄间距连接。本发明的目的是提供一种半导体用金焊线。器件及其制造方法,工业上适合大规模生产,其中,具有[111]取向的晶粒面积与具有[100]取向的晶粒面积之比]取向为1.2或更高。
CURRENT DIFFUSION BONDING APPARATUS AND CURRENT DIFFUSION
BODING
METHOD
因此,最多可以通过分析两次进样来确定
CE
电压的最佳值。
The method for continuously manufacturing an optical display panel according to the present invention includes an exchange step for exchanging new and old rolls, a carrier film conveyance step for conveying a belt-shaped carrier film, an optical cell conveyance step for conveying an optical cell, a peeling step for peeling an optical film from a carrier film, and a
boding
step for bonding an optical film to an optical cell to form an optical display panel, the exchange step including a mounting step for moving a second roll, which is next to be delivered, parallel to the conveyance direction of the belt-shaped carrier film and mounting the second roll to a second delivery unit provided parallel to a first delivery unit on which a first roll that is currently being delivered is mounted.
光学显示面板的连续制造方法包括在新旧卷之间切换的切换过程、用于传送带状载体膜的载体膜传送过程、用于传送光学单元的光学单元传送过程以及剥离光学膜切换步骤包括剥离步骤和在传送光学单元的同时将光学膜粘合到光学单元以
形成
光学显示面板的粘合步骤。该方法包括移动和安装第二辊的安装步骤接下来在与第一进料部分平行设置的第二进料部分中被送出。
A bonded body (10) composed of carbon thin film-coated article and rubber, prepared by superimposing an unvulcanized rubber (14) on a carbon thin film-coated article (13), in which a carbon thin film (12) is formed on the surface of an article (11), and then vulcanizing the rubber thereby
boding
the same. Thus, a bonded body comprising, for example, a rubber and a metal without requiring an adhesive can be provided.
碳薄膜覆盖体与橡胶的接合体10是将在物体11的表面形成有碳薄膜12的碳薄膜覆盖体13与未硫化橡胶14接合并硫化而得到的。例如,可以提供不需要粘合剂的橡胶和例如金属的接合体。
[PROBLEMS] To provide a metallized nonoxide ceramic molding that exhibits enhanced bonding strength between metal layer and substrate and enhanced
boding
durability, and provide a process for producing the same. [MEANS FOR SOLVING PROBLEMS] The process for producing a metallized molding is characterized by including the heating step of heating a nonoxide ceramic molding to a temperature 300ºC lower than the oxidation initiation temperature of the nonoxide ceramic or higher temperature substantially without solid dissolution of oxygen during the temperature rise; the oxidation step of bringing the nonoxide ceramic molding, as a substrate, heated by the heating step into contact with an oxidative gas and maintaining the same at a temperature higher than the oxidation initiation temperature of the nonoxide ceramic so that the nonoxide ceramic molding has its surface oxidized to thereby form an oxide layer; and the metallizing step of forming a metal layer on the surface of the oxide layer of the nonoxide ceramic molding having the oxidized layer provided on its surface in the oxidation step.
[解决方案] 本发明的金属化成形体的制造方法,其特征在于,将非氧化物陶瓷成形体加热至比非氧化物陶瓷的氧化开始温度低300℃的温度,且基本上不存在固溶氧。加热步骤,将非氧化物陶瓷基板加热至上述温度以上的温度,并且在使在加热步骤中加热的非氧化物陶瓷基板与氧化性气体接触之后,将非氧化物陶瓷基板加热至非氧化物陶瓷基板。氧化工序,将陶瓷基板保持在比非氧化物陶瓷的氧化开始温度高的温度,对氧化物陶瓷成形体的表面进行氧化,形成氧化物层,并在该氧化物层的表面形成金属层。 1.一种非氧化物陶瓷成型体,其特征在于,包括通过所述氧化工序得到的表面具有氧化层的非氧化物陶瓷成型体,其特征在于,包括金属化工序而形成。
Coding
and Designing Custom Windows Welcome Pages
编码
并设计自定义 Windows 欢迎页面
METHOD FOR
BONDING
FUSELAGE AND STRONG BACK
这种
连接机身的
方法允许定位器在不使用起重机的情况下支撑机身(6)。
BONDING
APPARATUS AND METHOD FOR CONTROLLING SAME
本发明提供一种廉价且小型的、能够利用转台有效地定位和接合工件的
接合
装置及其控制方法。
Finally, the SparkR development
coding
rules basically conformed to the Advanced R
coding
rules.
最终,SparkR开发的
编码
标准基本符合Advanced R
编码
标准。
SEMICONDUCTOR ELEMENT
BONDING
METHOD AND
BONDING
STRUCTURE
本发明提供一种在确保界面的优异的导电性和透明性的同时
接合
半导体元件的方法以及
使用
该
接合
方法的接合结构体。
IMAGE
CODING
DEVICE AND IMAGE
CODING
METHOD
提供 能够防止使用可变长度编码的编码中的图像质量劣化的图像
编码
装置和图像
编码
方法。
听听“ boding ”的陆地声音(发音)!
以下是观看下面的视频时练习「boding」发音的文本。

